Resources
The Secret to Fast and Accurate Software Builds: Path to Building Smarter Makefiles
Electric Cloud
This whitepaper looks at solutions to the dependency problem in Make and GNU Make – the de-facto build tool of choice for many software development teams. The paper identifies the key problems in Make dependency management and explains how solving these problems helps achieve faster and accurate software build times.
The author of this whitepaper, John Graham-Cumming, Co-Founder of Electric Cloud, Inc. discusses how to automate and optimize dependencies between files in a software build. Three main types of dependencies are discussed: those that exist between source and object files (that are used to regenerate objects when source changes), those that exist between objects (for example, used to drive a linker), and dependencies at the module or project level.
The paper is technical in nature and aimed at someone with a general familiarity of Make. Experienced users of GNU Make should find the examples of interest.
12 April 2013
RTC Group Taps Industry Leader Clarence Peckham Brings His Technology/Market Expertise to Publications Team as Senior Editor
The RTC Group
SAN CLEMENTE, CALIF., December 11, 2012 – RTC Group, Inc.,—foremost supplier of marketing resources to the embedded computing industry and publisher of premier industry technology publications including RTC, MEDS and COTS Journal —announces industry leader Clarence Peckham has joined the RTC Group’s editorial team.
20 December 2012
RTC Group Taps Renowned Defense Programs Editor
The RTC Group
SAN CLEMENTE, CALIF., DECEMBER 05, 2012 – RTC Group, Inc. (RTC), foremost supplier of marketing resources to the embedded computing industry and publisher of the military electronics industry’s leading technology publication – COTS Journal – announces Johnny Keggler will be joining the COTS Journal editorial team to produce the Military Intelligent Systems Journal, a supplement to COTS Journal.
13 December 2012
High-end graphics performance for low-power small-form-factor (SFF) designs
Kontron
Kontron boards and modules with AMD's Embedded G-Series platform for graphics-intensive SFF applications make migration easy
18 October 2012
Improved Graphics Performance Changes the Cost Equation in Digital Signage
Intel Corporation
The quality and flexibility of digital signage is a function of the graphics processing capability of the media players that drive the displays. To deliver a high level of graphics performance, media players tend to incorporate discrete graphics processing units (GPUs), although some players use the graphics engine on the CPU platform. But more vendors are expected to turn to integrated graphics as performance increases, and it becomes better aligned to CPU performance...
By providing your contact information you are authorizing Intel to contact you by telephone or e-mail with more information about Intel architecture.
8 August 2012
Improving Build-to-Order Operations with Digital Signage
Nexcom
In this paper, we provide eight tips on the benefits and advantages of digital signage systems. We also offer advice on what to look for in buying such a system for use in communicating SOPs on the factory floor. In terms of hardware, we particularly focus on the benefits of the new Intel AtomTM processor D2700 and its use in one of our own digital media players, the NEXCOM NDiS 126.
17 April 2012
Why Choose an Embedded System for Your Next Application
AMD
Many system integrators and end customers continue to choose standard PC platforms for certain types of embedded applications. While standard PCs of the past did have some advantages over custom designed embedded platforms, especially for applications that required "PC-like" performance and capabilities at a low off-the-shelf cost. However, the embedded solutions landscape is changing dramatically to better serve these applications.
Evolutions in embedded system technology and design including the proliferation of standards-based interfaces and platforms, coupled with rapid advancements in CPU and graphics performance have closed the gap with PCs.
There are hidden lifecycle management costs associated with deploying typical, commercially available PCs in embedded applications that are not always well understood.
27 February 2012
Finding Concurrency Errors with Static Analysis
GrammaTech Inc
Although decades of advances in miniaturization have yielded enormous performance gains
for single processors, it now appears that this era is coming to a close. The industry has
placed a big bet on future single-chip performance gains coming from increasing core
counts, but this will only be a winning wager if software can be programmed to take
advantage of parallel processors.
7 September 2011
PowerProtector - The Solution For Sudden Powerdown in NAND Flash Modules/Drives
ATP Electronics Inc
Industrial Grade storage such as CF, embedded modules and SSD's require
superior performance and reliability that surpass what is currently offered by existing
SuperCap designs. ATP's patented Power Protector Technology ensures data integrity
during a sudden power down in all conditions.
8 August 2011
Building a Better Embedded Solution
Concurrent Computer Corp.
Whether you are building hard real-time embedded applications or just need an easy-to-use/cost-effective embedded platform for development and deployment, a reliable high-performance embedded operating system is just the beginning to a successful project. In this paper, you will get a full view of Concurrent Real Time's solution for the embedded industry, the RedHawk Embedded Linux platform. You will learn how RedHawk Embedded puts you in control of your embedded software and multi-core system resources with fully integrated tools to "build a better embedded solution." Improved ability to control costs, support and professional services round out the solution.
8 March 2011
FUNDAMENTALS OF MULTICORE: Operating Systems for Telecom/Networking Applications
ENEA
This white paper provides a "tutorial like" overview of the fundamental issues that
apply to multicore software operating systems implementation for the telecom/
networking space. It starts with consideration of the di!erent generic application
processing classes in telecom/networking (e.g. control plane, data plane). It then
considers the mapping of these processing requirements to the two primary
software processing models for multicore (e.g. SMP, AMP, etc).
6 December 2010
Comparing BIOS and Boot Loader Features
Insyde Software
This document helps developers quickly evaluate transition paths from an existing boot loader platform to an Intel Atom platform. Should they adapt their existing boot loader, use the Intel boot loader kit, the Insyde royalty-free do-it-yourself UEFI firmware provided by InsydeDiY, or a fully functional customized BIOS with industry-tested InsydeH2O?
10 November 2010
Bigger Jobs in the Same Space
Advanced Digital Logic
The increase in CPU power, memory and interconnect bandwidth in step with Moore's Law and implemented as PCIe/104, continues to multiply the computing power within the PC/104 form factor. And this one still has room to grow.
25 October 2010
Data-Oriented Architecture: A Loosely-Coupled Real-Time SOA
Real-Time Innovations
As more devices and systems get woven into the fabric of our networked world, the scale and the complexity of integration is growing at a rapid pace. Our existing methodologies and training for system software design, rooted in principles of object-oriented design, that worked superbly for small scale systems begin to break down as we discover operational limits which requires frequent and unintended redesigns in programs year over year. Fundamentally, object-oriented thinking leads us to think in terms of tightly-coupled interactions that include strong state assumptions. Large scale distributed systems are often a mix of subsystems created by independent parties, often using different middleware technologies, with misaligned interfaces. Integrating such sub-systems using object-oriented thinking poses some fundamental challenges.
6 July 2010
Computer-on-Modules: Enabling Longevity and Scalability for Innovative Embedded Applications
Kontron
6 July 2010
Shrinking Dies and Cooling PC/104
Advanced Digital Logic
One of the dilemmas facing mechanical engineers is the perpetually shrinking size of processor dies, which presents major thermal management challenges in PC/104 systems. Instead of relying on traditional heat sink and fan solutions, designers can use transmissive thermal interface systems to transfer heat out of small die processor boards in keeping with PC/104 height specifications.
7 May 2010
How to Automatically Ensure Military/Aerospace Software Meets Quality and Compliance Requirements
Coverity
Gain insight into how to successfully overcome strict compliance and testing requirements, and increasing demand for increasingly complex functionality with Coverity software integrity products for organizations with zero tolerance policies for software failures and security breaches. Results summarized alongside Deloitte, VDC Research, and other studies.
25 March 2010
Compliance and Regulation: Meet DO-178B Software Verification Guidelines with Coverity Integrity Center
Coverity
The Federal Aviation Administration (FAA) recognizes DO-178B, one of the most stringent standards in use in the software development industry, as an acceptable means of compliance for securing the FAA approval of software in airborne systems and equipment. This document will discuss how the Coverity Integrity Center can help with specific software verification guidelines as outlined in DO-178B.
25 March 2010
Minimal Boot Loader for Intel Architecture
Intel
The intent of this White paper is to describe the minimal initialization steps
that are necessary in order to boot to an Intel Architecture (IA) platform.
The Intel Embedded Design Center provides qualified developers with web-based
access to technical resources. Access Intel Confidential design materials, step-by step
guidance, application reference solutions, training, Intel's tool loaner program, and
connect with an e-help desk and the embedded community. Design Fast. Design
Smart. Get started today. www.intel.com/embedded/edc.
17 March 2010
PCI Express Expansion in the Industrial Marketplace (January 2005):
One Stop Systems
Market Needs and Applications of PCI Express Expansion Products
24 February 2010
MAX Express Expansion Overview
One Stop Systems
Illustrated Overview
24 February 2010
Anatomy of MAX Express Cable Expansion (White Paper, August 2005):
One Stop Systems
How to build a high-speed PCI Express Expansion System using MAX Express products
24 February 2010
CompactPCI and AdvanceTCA Systems Magazine (August 2006):
One Stop Systems
A Guide to CompactPCI Express
24 February 2010
HSIB™ — A New Interoperable, High-Bandwidth, Low-Latency Bus based on Cabled PCI Express:
One Stop Systems
This paper introduces the HSIB bus, a new higher-bandwidth, lower-latency instrument control bus. HSIB extends cabled PCI Express to solve high-performance test problems by defining how multiple PCs and/or instruments can transfer data. This paper covers HSIB technical and business benefits, challenges of standardizing cabled PCI Express, HSIB physical and software layers, early prototype benchmarking results, and future direction.
24 February 2010
Meeting Real-Time Requirements in Integrated Defense Systems
Real-Time Innovations
This paper examines the challenges faced by defense network software, traces the evolution of real-time requirements, and examines how the required performance is possible with modern, standards-based, commercial technology.
24 February 2010
Using Embedded Linux and Flash Memory to Build Responsive and Reliable Products
Datalight
Whether you’re considering a move to embedded Linux, or you’re fully immersed in embedded Linux development, there are steps you can take to ensure a successful project and avoid some of the common pitfalls of working with flash in this environment. This whitepaper examines the current situation embedded Linux developers find themselves in based on three key trends, explores the dos and don’ts, and gives you some tips to make your embedded Linux projects successful.
24 February 2010
Increase Revenues with Digital Video Surveillance
Adaptec/Seagate/Arrow
With the migration from analog systems to digital systems, video surveillance has become a booming market whose growth is estimated
24 February 2010
High-Density, High-Performance Integrated, Multi-Chip Memory Solutions
Austin Semiconductor
In 2006, Austin Semiconductor answered the challenge with the iPEM product line. This new product family definition was based on a 32mm x 25mm, 255 ball BGA with a ball pitch of 1.27mm. This product was defined with DDR2 as the basis for the product family electro-mechanical interconnect, facilitating backward compatibility architecture wise and backward as well as forward density migration for all family architecture members.
24 February 2010
COTS Embedded Database Solving Dynamic Points-of-Interest
Birdstep Technology, Inc.
In navigation devices of today the This article looks at how commercial of the shelf (CTOS) database solutions can be utilized to solve the dynamic point of interest problem.
24 February 2010
Data Management Solution: Build vs. Buy
Birdstep Technology, Inc.
This article explores
24 February 2010
Database Management in Real-time and Embedded Systems
Birdstep Technology, Inc.
This article points out things to consider when making the decision to go with a commercial real-time embedded database or build your own. It also makes some comments around database models to utilize to get your job done.
24 February 2010
Moxa secret behind wide temperature technology
MOXA
What does it take to design wide temperature computers that generally have an operating temperature range of -40°C to 75°C? By constructing an industrial computer to be operable under extreme heat and cold, manufacturers can assure reliability and reduce the likelihood of product failure for applications in a variety of harsh environments over extended periods of time. Download this white paper to learn more about the secrets behind wide temperature computers.
24 February 2010
Designing with ARM Based Systems
Mentor Graphics
The ARM architecture is the most widely used processor architecture in the world with new licensees signing up every month. Supporting this growth is the ARM Connected Community which forms a broad ecosystem to support designers using ARM cores. Mentor Graphics are at the forefront of the ARM Connected Community from both a hardware EDA perspective as well as from the embedded software side where their Nucleus OS is deployed on more ARM powered devices than any other operating system.
24 February 2010
Embedded Computers for Substation Automation
Moxa
Power substations play a critical role in transporting electricity from power plants to homes, businesses, and factories. However, a typical power grid can be comprised of hundreds of substations that need to monitored and controlled. Thanks to the rapid growth of computer and communication technology, power substations are becoming more automated and increasingly deploy intelligent devices to monitor and control unmanned facilities. Key factors to establishing successful substation automation systems include faster and more reliable networking solutions such as embedded computers. This white paper discusses how embedded computer systems can provide reliable automation for power substation networks.
24 February 2010
Extending PCI-Express in MicroTCA Platforms
Magma
Magma's AMC Adapter allows telecommunication solution providers to extend MicroTCA's traditional role as a chassis for AMC modules to now include legacy hardware built around PCI and PCI Express bus architectures.
24 February 2010
The Vision for Next Generation CompactPCI (R) and PICMG 2.30 Standards Featuring 3M Connectors and Men Micro SBCs
MEN Micro
This webinar reviews how the new PICMG 2.30 CompactPCI PlusIO standard adds serial functions on the J2 rear I/O connector in CompactPCI systems for added flexibility and versatility as well as easier system upgrades. Implementation examples at the system, board (SBC) and connector level are demonstrated.
24 February 2010
Everything You Ever Wanted to Know about Data Acquisition and Embedded Control: Part One - Analog Inputs
UEI
Everything You Ever Wanted to Know about Data Acquisition and Embedded Control: Part One — Analog Inputs," covers popular system types, A/D conversion, input channel configuration, simultaneous sampling, accuracy specifications, sample rate, input range, and more.
24 February 2010
Design considerations in building shielded enclosures
Equipto Electronics
Designing enclosures to protect against EMI requires following standards, making careful materials selection, and most importantly, backing up theoretical knowledge with first-hand experience.
24 February 2010
The Future of CAN / CANopen and the Industrial Ethernet Challenge
ESD Electronics, Inc
Industrial Ethernet technologies are a formidable challenge to CANopen as the low-cost industrial networking technology of choice. Ethernet technologies will eventually replace the majority of CANopen applications, at least in regards to new developments
24 February 2010
Embedded Computing: The Next Generation Merging the best of PC/104 and COM-style architectures
Diamond Systems
This whitepaper examines an emerging paradigm in embedded computing, the "Embedded-Ready Subsystem", how it evolved and its benefits compared to popular stackable architectures, such as PC/104, and computer-on-module systems.
24 February 2010
FlightSafety uses UEI's RACKtangle I/O System
UEI
Learn how FlightSafety International Simulation, uses United Electronic Industries' RACKtangle Input/Output linkage to increase performance while saving time, money and space.
24 February 2010
A Modern Alternative to VME
UEI
The Ethernet I/O chassis from United Electronic Industries is a modern alternative to aging VME systems and why FlightSafety International has switched from VME to UEI's Gigabit Ethernet RACKtangle I/O chassis
24 February 2010


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